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而EMIB-T则在硅桥中引入TSV通孔结构,使得信号可垂直穿越桥接芯片本体,实现更高密度、更短路径的垂直互连。
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Основное преимущество технологии в том, что ее можно масштабировать путем разведения, а не заводского производства.,详情可参考heLLoword翻译官方下载